Inguqulo Ethuthukisiwe Yekhadi Lezithombe Zokusingatha Ideskithophu I-CPU Air Cooled Radiator CPU Cooler Six Copper Tube Mute Multi-Platform
Imininingwane Yomkhiqizo
Indawo yokuthengisa umkhiqizo wethu
Ukugeleza okumangalisayo!
Amapayipi okushisa ayisithupha!
Ukulawula okuhlakaniphile kwe-PWM!
Ukuhambisana kwamapulatifomu amaningi-Intel/AMD!
Inguqulo ethuthukisiwe, i-screw buckle!
Izici Zomkhiqizo
Umphumela wokukhanya okhazimulayo!
Ifeni ye-Dazzle engu-120mm iyakhazimula kusukela ngaphakathi ukuze ujabulele inkululeko yombala
I-PWM Intelligent yokulawula izinga lokushisa.
Isivinini se-CPU silungiswa ngokuzenzakalela nezinga lokushisa le-CPU.
Ngaphezu kokukhanga kobuhle, ifeni ye-Dazzle iphinde ihlanganise ne-PWM (Pulse Width Modulation) isilawuli sokushisa esihlakaniphile.
Lokhu kusho ukuthi ijubane lomlandeli lilungiswa ngokuzenzakalelayo ngokusekelwe kuzinga lokushisa le-CPU.
Njengoba izinga lokushisa le-CPU likhuphuka, ijubane labalandeli lizokhula ngokufanele ukuze linikeze ukupholisa okuphumelelayo nokugcina amazinga okushisa alungile.
Isici esihlakaniphile sokulawula izinga lokushisa siqinisekisa ukuthi ifeni isebenza ngesivinini esidingekayo ukuze ikhiphe ngempumelelo ukushisa ku-CPU, kuyilapho inciphisa umsindo nokusetshenziswa kwamandla.Lokhu kusiza ukugcina ibhalansi phakathi kokusebenza kokupholisa kanye nokusebenza kahle kohlelo lonke.
Amapayipi okushisa ayisithupha athintana ngqo!
Ukuxhumana okuqondile phakathi kwamapayipi okushisa ne-CPU kuvumela ukudluliswa kokushisa okungcono nokushesha, njengoba kungekho nto eyengeziwe noma isixhumi esibonakalayo phakathi kwawo.
Lokhu kusiza ukunciphisa noma yikuphi ukumelana nokushisa nokwandisa ukusebenza kahle kokukhipha ukushisa.
I-HDT Compaction technique!
Ipayipi lensimbi alixhumene nendawo ye-CPU.
Umphumela wokupholisa nokumunca ukushisa ubaluleke kakhulu.
Indlela yokuhlanganisa ye-HDT (Heatpipe Direct Touch) ibhekisela esicini sokuklama lapho amapayipi okushisa enziwa isicaba, okuwavumela ukuthi athintane ngokuqondile ne-CPU.Ngokungafani namasinki okushisa okuvamile lapho kukhona i-base plate phakathi kwamapayipi okushisa ne-CPU, idizayini ye-HDT ihlose ukukhulisa indawo yokuxhumana nokuthuthukisa ukusebenza kahle kokudlulisa ukushisa.
Esu lokuhlanganisa i-HDT, amapayipi okushisa ayafiphazwa futhi akheke ukuze akhe indawo eyisicaba ethinta i-CPU ngokuqondile.Lokhu kuthintana okuqondile kuvumela ukudluliswa kokushisa okuphumelelayo kusuka ku-CPU kuya kumapayipi okushisa, njengoba kungekho nto eyengeziwe noma isendlalelo esibonakalayo phakathi.Ngokususa noma yikuphi ukumelana nokushisa okungaba khona, idizayini ye-HDT ingafinyelela ukulahlwa kokushisa okungcono nokusheshayo.
Ukungabikho kwe-base plate phakathi kwamapayipi okushisa nendawo ye-CPU kusho ukuthi alikho igebe noma isendlalelo somoya esingavimbela ukudluliswa kokushisa.Lokhu kuthintana okuqondile kunika amandla ukumuncwa okusebenzayo kokushisa okuvela ku-CPU, kuqinisekisa ukuthi ukushisa kudluliselwa ngokushesha kumapayipi okushisa ukuze kuhlakazwe.
Umthelela wokupholisa nokumunca ukushisa ubaluleke kakhulu ngendlela yokuhlanganisa i-HDT ngenxa yokuxhumana okuthuthukisiwe phakathi kwamapayipi okushisa ne-CPU.Lokhu kubangela ukuqhutshwa kwe-thermal okungcono nokusebenza okuthuthukisiwe kokupholisa.Ukuxhumana okuqondile nakho kusiza ukuvimbela izindawo ezishisayo nokusabalalisa ukushisa ngokulinganayo kuwo wonke amapayipi okushisa, ukuvimbela ukushisa okweqile kwendawo.
Inqubo yokubhoboza Fin!
Indawo yokuxhumana phakathi kwe-fin nepayipi yokushisa iyanda.
Thuthukisa ngempumelelo ukudluliswa kokushisa kahle
Ukuhambisana kwamapulatifomu amaningi!
I-Intel: 115x/1200/1366/1700
I-AMD:AM4/AM3(+)